Cristin-resultat-ID: 1043405
Sist endret: 27. februar 2014, 14:33
NVI-rapporteringsår: 2013
Resultat
Vitenskapelig artikkel
2013

Die Shear Testing of a Novel Isotropic Conductive Adhesive-Epoxy Filled With Metal-Coated Polymer Spheres

Bidragsytere:
  • Hoang Vu Nguyen
  • Erik Andreassen
  • Helge Kristiansen og
  • Knut E. Aasmundtveit

Tidsskrift

IEEE Transactions on Components, Packaging, and Manufacturing Technology
ISSN 2156-3950
e-ISSN 2156-3985
NVI-nivå 1

Om resultatet

Vitenskapelig artikkel
Publiseringsår: 2013
Publisert online: 2013
Trykket: 2013
Volum: 3
Hefte: 7
Sider: 1084 - 1093

Importkilder

Isi-ID: 000321630400002

Beskrivelse Beskrivelse

Tittel

Die Shear Testing of a Novel Isotropic Conductive Adhesive-Epoxy Filled With Metal-Coated Polymer Spheres

Sammendrag

Isotropic conductive adhesives (ICAs) filled with metal-coated polymer spheres (MPS) are introduced to improve the mechanical reliability compared with conventional ICAs filled with silver (Ag) flakes. This paper deals with the die shear performance of an MPS-based ICA; an epoxy filled with 45 vol% of $varnothing, 30;{mu{rm m}}$ Ag-coated monodisperse polymer spheres. The curing kinetics of the ICA is also studied. The MPS-based ICA is compared with two ICAs filled with Ag flakes: an in-house prepared ICA (with the same epoxy matrix as the MPS-based ICA) and a commercially available ICA. Both ICAs with Ag flakes have a lower particle volume fraction than the MPS-based ICA. Loading 45 vol% of MPS into the epoxy matrix has no significant effect on the curing kinetics and the glass transition temperature $(T_{g})$ of the matrix. The MPS-based ICA has 140% higher die shear strength than the in-house prepared ICA with Ag flakes, and 23% higher die shear strength than the commercial ICA with Ag flakes. The MPS-based ICA also has higher shear strain at failure, and less scatter in shear strength between repeated tests. Hence, the MPS-based ICA has a good potential for demanding applications; it has better die shear performance and higher $T_{g}$ than the commercial ICA with Ag flakes.

Bidragsytere

Hoang Vu Nguyen

  • Tilknyttet:
    Forfatter
    ved Institutt for mikrosystemer ved Universitetet i Sørøst-Norge

Erik Andreassen

  • Tilknyttet:
    Forfatter
    ved Institutt for mikrosystemer ved Universitetet i Sørøst-Norge
  • Tilknyttet:
    Forfatter
    ved Materialer og nanoteknologi ved SINTEF AS

Helge Kristiansen

  • Tilknyttet:
    Forfatter
    ved Diverse norske bedrifter og organisasjoner
  • Tilknyttet:
    Forfatter
    ved Conpart AS

Knut Aasmundtveit

Bidragsyterens navn vises på dette resultatet som Knut E. Aasmundtveit
  • Tilknyttet:
    Forfatter
    ved Institutt for mikrosystemer ved Universitetet i Sørøst-Norge
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