Cristin-resultat-ID: 1241534
Sist endret: 10. august 2015, 11:20
NVI-rapporteringsår: 2015
Resultat
Vitenskapelig artikkel
2015

Microstructural characterization of Si wafers processed by multi-wire sawing of hot pressed silicon powder based ingots

Bidragsytere:
  • Rajko Buchwald
  • Sindy Würzner
  • Hans Joachim Möller
  • Arjan Ciftja
  • Gaute Stokkan
  • Eivind Johannes Øvrelid
  • mfl.

Tidsskrift

Physica Status Solidi (a) applications and materials science
ISSN 1862-6300
e-ISSN 1862-6319
NVI-nivå 1

Om resultatet

Vitenskapelig artikkel
Publiseringsår: 2015
Volum: 212
Hefte: 1
Sider: 25 - 29

Importkilder

Scopus-ID: 2-s2.0-84920886978

Beskrivelse Beskrivelse

Tittel

Microstructural characterization of Si wafers processed by multi-wire sawing of hot pressed silicon powder based ingots

Sammendrag

The purpose of this work is to verify the possibility to process highly doped Si supporting substrates using a 2-step process: (i) sintering of a low-cost Si powder based ingot using hot pressing and a ELKEM Silgrain material as a feedstock; and (ii) wafering of such ingots using multi-wire sawing technique similar to that, which is used for cast multi-Si or Cz-Si grown ingots. Moreover, the possibility to dope Si powder ingot at sintering temperatures below melting point of Si, using a mixture of Si and boron powders to fabricate highly conductive Si wafers is verified as well. The slurry technique has been chosen for multi-wire sawing of sintered Si powder based ingots. Surface properties of Si powder based substrates as well as their chemical composition have been studied by optical microscopy imaging and energy-dispersive X-ray spectroscopy (EDX). Although the overall concentrations of oxygen, carbon and possibly also metal impurities, which are initially present in a low-cost Si feedstock, are too high to achieve acceptable semiconducting properties, it is concluded, that sintered Si powder based wafers have high enough conductivity (resistivity ∼0.001 Ω cm) to serve as supporting substrates for low cost Si wafer equivalent structures.

Bidragsytere

Rajko Buchwald

  • Tilknyttet:
    Forfatter
    ved Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Sindy Würzner

  • Tilknyttet:
    Forfatter
    ved Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Hans Joachim Möller

  • Tilknyttet:
    Forfatter
    ved Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Arjan Ciftja

  • Tilknyttet:
    Forfatter
    ved Bærekraftig energiteknologi ved SINTEF AS

Gaute Stokkan

  • Tilknyttet:
    Forfatter
    ved Bærekraftig energiteknologi ved SINTEF AS
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