Sawing of silicon wafers: Techniques, effects on wafers and recycling of sawdust

A brief overview of the wafering of silicon for solar cells is given. The present day-technological standard of the multi-wire saw is treated in some detail, with descriptions of the material removal process on a microscopic scale as well as the problems related to the need for a cost intensive slurry and the high material loss associated with this method. As possible future solutions, three potential next-generation technologies are introduced and compared to the current industrial standard. The alternative of reducing the cost of the present technology through recycling of slurry components and Si sawdust is also explored.