Cristin-resultat-ID: 1267912
Sist endret: 24. september 2015, 17:39
Resultat
Rapport
2009

Sawing of silicon wafers: Techniques, effects on wafers and recycling of sawdust

Bidragsytere:
  • Halvor Dalaker

Utgiver/serie

Utgiver

SINTEF rapport

Serie

SINTEF Rapport
ISSN 1504-9795

Om resultatet

Rapport
Publiseringsår: 2009
Antall sider: 17
ISBN: 9788214043259

Importkilder

SINTEF AS-ID: A13742

Beskrivelse Beskrivelse

Tittel

Sawing of silicon wafers: Techniques, effects on wafers and recycling of sawdust

Sammendrag

A brief overview of the wafering of silicon for solar cells is given. The present day-technological standard of the multi-wire saw is treated in some detail, with descriptions of the material removal process on a microscopic scale as well as the problems related to the need for a cost intensive slurry and the high material loss associated with this method. As possible future solutions, three potential next-generation technologies are introduced and compared to the current industrial standard. The alternative of reducing the cost of the present technology through recycling of slurry components and Si sawdust is also explored.

Bidragsytere

Halvor Dalaker

  • Tilknyttet:
    Forfatter
    ved Bærekraftig energiteknologi ved SINTEF AS
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