Cristin-resultat-ID: 1273418
Sist endret: 24. september 2015, 21:16
Resultat
Vitenskapelig foredrag
2007

Technologies enabling 3D stacking of MEMS

Bidragsytere:
  • Maaike Margrete Visser Taklo og
  • Michal Marek Mielnik

Presentasjon

Navn på arrangementet: IEEE workshop on 3D System Integration
Sted: München
Dato fra: 1. oktober 2007
Dato til: 2. oktober 2007

Arrangør:

Arrangørnavn: Fraunhofer IZM

Om resultatet

Vitenskapelig foredrag
Publiseringsår: 2007

Importkilder

SINTEF AS-ID: S2865

Beskrivelse Beskrivelse

Tittel

Technologies enabling 3D stacking of MEMS

Sammendrag

In order to realize reliable 3D stacking of micro electromechanical systems (MEMS), interconnection and through wafer via technologies have been adapted from other areas and verified for MEMS applications. True stacking of a system including MEMS requires vias through the MEMS and electrical and mechanical interconnection to other devices like signal conditioning units and communication- and power devices. MEMS will typically have specific requirements regarding mechanical issues like stiffness, robustness, volume, and mass. The mechanical issues limit the range of applicable technologies. In this work three interconnection technologies have been selected, evaluated, and compared: Au stud bump bonding, SnAg micro bumps, and the SLID (solid liquid interdiffusion) technology using Sn and Cu. One via technology has been considered, namely hollow vias, which has been improved and tested in this work.

Bidragsytere

Maaike Margrete Visser Taklo

  • Tilknyttet:
    Forfatter
    ved Smart Sensor Systems ved SINTEF AS

Michal Marek Mielnik

  • Tilknyttet:
    Forfatter
    ved Microsystems and Nanotechnology ved SINTEF AS
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