Cristin-resultat-ID: 1065514
Sist endret: 20. januar 2015, 14:14
NVI-rapporteringsår: 2013
Resultat
Vitenskapelig Kapittel/Artikkel/Konferanseartikkel
2013

Failure analysis of thermally and mechanically stressed plastic core solder balls

Bidragsytere:
  • Maaike Margrete Visser Taklo
  • Joachim Seland Graff
  • Daniel Nilsen Wright
  • Helge Kristiansen
  • Lars Hoff og
  • Knut Waaler

Bok

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 28-31 May 2013, Las Vegas, NV
ISBN:
  • 978-1-4799-0233-0

Utgiver

IEEE conference proceedings
NVI-nivå 1

Serie

Electronic Components and Technology Conference (ECTC)
ISSN 0569-5503
e-ISSN 2377-5726
NVI-nivå 1

Om resultatet

Vitenskapelig Kapittel/Artikkel/Konferanseartikkel
Publiseringsår: 2013
Hefte: 63rd
Sider: 748 - 754
ISBN:
  • 978-1-4799-0233-0

Klassifisering

Fagfelt (NPI)

Fagfelt: IKT
- Fagområde: Realfag og teknologi

Beskrivelse Beskrivelse

Tittel

Failure analysis of thermally and mechanically stressed plastic core solder balls

Sammendrag

Plastic Core Solder Balls (PCSB) offer improved mechanical compliance compared to traditional solder balls in assemblies where materials with significantly different coefficient of thermal expansion are present. However, failure mechanisms for systems with lead free PCSB have not been studied sufficiently to allow direct replacement in applications for harsh environments. An assembly of a ceramic carrier onto an organic circuit board intended for application in a harsh environment subsea has been studied with regard to replacement of traditional lead free solder balls with lead free PCSB. Assembled test vehicles were exposed to mechanical and thermal environmental stress testing and failure analysis performed. Degradation of the PCSBs was observed in electrical measurements and in studies of cross sectioned test vehicles. Cracks were observed in relation to formation of intermetallic compounds and a suggestion is made with regard to improvement of the metal system of the PCSBs.

Bidragsytere

Maaike Margrete Visser Taklo

  • Tilknyttet:
    Forfatter
    ved Smart Sensors and Microsystems ved SINTEF AS

Joachim Seland Graff

  • Tilknyttet:
    Forfatter
    ved Bærekraftig energiteknologi ved SINTEF AS

Daniel Nilsen Wright

  • Tilknyttet:
    Forfatter
    ved Smart Sensors and Microsystems ved SINTEF AS

Helge Kristiansen

  • Tilknyttet:
    Forfatter
    ved Conpart AS

Lars Hoff

  • Tilknyttet:
    Forfatter
    ved Institutt for mikrosystemer ved Universitetet i Sørøst-Norge
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Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 28-31 May 2013, Las Vegas, NV.

IEEE, .. 2013, IEEE conference proceedings. Vitenskapelig antologi/Konferanseserie
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