Cristin-resultat-ID: 1239966
Sist endret: 30. oktober 2017, 11:10
NVI-rapporteringsår: 2015
Resultat
Vitenskapelig artikkel
2015

Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity

Bidragsytere:
  • Nishant Malik
  • Hannah Rosquist Tofteberg
  • Erik Poppe
  • Terje Finstad og
  • Kari Schjølberg-Henriksen

Tidsskrift

ECS Journal of Solid State Science and Technology
ISSN 2162-8769
e-ISSN 2162-8777
NVI-nivå 1

Om resultatet

Vitenskapelig artikkel
Publiseringsår: 2015
Publisert online: 2015
Trykket: 2015
Volum: 4
Hefte: 7
Sider: P236 - P241
Open Access

Importkilder

Scopus-ID: 2-s2.0-84930169785

Beskrivelse Beskrivelse

Tittel

Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity

Sammendrag

Hermeticity, reliability and strength of four laminates bonded at different temperatures by Au-Au thermocompression bonding have been investigated. Laminates with a diameter of 150 mm were realized by bonding a wafer containing membrane structures to a Si wafer with patterned bond frames. A bond tool pressure of 2266 mbar was applied for 15 minutes at temperatures ranging from 150–300°C. The hermetic properties were estimated by membrane deflection measurements applying white-light interferometry after bonding. Reliability was tested by exposing the laminates to a steady-state life test, a thermal shock test, and a moisture resistance test. Bond strength was estimated by pull test measurements. A dicing yield above 90% was obtained for all laminates. Laminates bonded at 200°C and above had significantly higher hermetic yield than the laminate bonded at 150°C. No degradation in hermeticity was observed after the reliability tests. The maximum leakage rate (MLR) was estimated from two measurements of membrane deflection executed at two different times and was below 10−11 mbar ⋅ l ⋅ s−1. The average bond strength ranged from 44 to 175 MPa.

Bidragsytere

Nishant Malik

  • Tilknyttet:
    Forfatter
    ved Smart Sensors and Microsystems ved SINTEF AS
  • Tilknyttet:
    Forfatter
    ved Fysisk institutt ved Universitetet i Oslo
  • Tilknyttet:
    Forfatter
    ved Senter for materialvitenskap ved Universitetet i Oslo

Hannah Rosquist Tofteberg

  • Tilknyttet:
    Forfatter
    ved Smart Sensors and Microsystems ved SINTEF AS

Erik Utne Poppe

Bidragsyterens navn vises på dette resultatet som Erik Poppe
  • Tilknyttet:
    Forfatter
    ved Smart Sensors and Microsystems ved SINTEF AS

Terje Gunnar Finstad

Bidragsyterens navn vises på dette resultatet som Terje Finstad
  • Tilknyttet:
    Forfatter
    ved Senter for materialvitenskap ved Universitetet i Oslo
  • Tilknyttet:
    Forfatter
    ved Fysisk institutt ved Universitetet i Oslo

Kari Schjølberg-Henriksen

  • Tilknyttet:
    Forfatter
    ved Smart Sensors and Microsystems ved SINTEF AS
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