Cristin-resultat-ID: 2231494
Sist endret: 21. januar 2024, 18:51
NVI-rapporteringsår: 2024
Resultat
Vitenskapelig artikkel
2024

TEEMO: Temperature Aware Energy Efficient Multi-Retention STT-RAM Cache Architecture

Bidragsytere:
  • Sukarn Agarwal
  • Shounak Chakraborty og
  • Hans Magnus Själander

Tidsskrift

Proceedings, International Parallel and Distributed Processing Symposium (IPDPS)
ISSN 1530-2075
NVI-nivå 1

Om resultatet

Vitenskapelig artikkel
Publiseringsår: 2024
Publisert online: 2024

Klassifisering

Vitenskapsdisipliner

Datateknologi

Beskrivelse Beskrivelse

Tittel

TEEMO: Temperature Aware Energy Efficient Multi-Retention STT-RAM Cache Architecture

Sammendrag

The potential benefits of high density, non-volatility, and reduced leakage-power consumption make STT-RAM a credible successor to SRAM in caches. However, STT-RAMs experience higher write energy and latency, curtailing their potential for commercial implementation. Relaxing the retention time of STT-RAM can overcome these downsides by reducing both write latency and energy. But, significant reduction in retention time can result in premature expiry of blocks requiring frequent refreshes or write backs, which can increase the cache miss rate and impact performance. Our proposed technique, TEEMO, divides an STT-RAM-based last level cache (LLC) set-wise into two parts with different retention times. Fetched cache blocks are placed in the corresponding sets based on the requests type (i.e., read or write). By dynamically tracking recent access intensities, blocks are prudentially managed such that write-intensive blocks are directed to LLC sets with lower retention time, whereas LLC sets with higher retention time handle read-intensive blocks. Moreover, maintaining uniform temperature across an LLC bank is crucial as temperature directly affects the performance, retention time, and lifetime of the STT-RAM cells. By employing a write-counter-based dynamic block allocation, TEEMO balances write accesses across the cache sets to maintain a uniform power density, and hence, the temperature, across the LLC bank. Our evaluation shows that TEEMO reduces the energy-delay product with up to 44.8% and improves performance by 12.5%, on average, over a baseline SRAM based ISO-area LLC. TEEMO reduces the spatial thermal variance from 8.1 °C to 4.2 °C, and reduces chip failure rate by more than 95% over prior art.

Bidragsytere

Sukarn Agarwal

  • Tilknyttet:
    Forfatter
    ved Indian Institute of Technology Mandi

Shounak Chakraborty

  • Tilknyttet:
    Forfatter
    ved Institutt for datateknologi og informatikk ved Norges teknisk-naturvitenskapelige universitet
Aktiv cristin-person

Hans Magnus Själander

  • Tilknyttet:
    Forfatter
    ved Institutt for datateknologi og informatikk ved Norges teknisk-naturvitenskapelige universitet
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